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About Bystronic Group
 
Home >  Products >  Laser cutting >  BySprint Pro
 

BySprint Pro

Unique high-speed laser cutting system for the highest operational and economic efficiency

BySprint Pro

Customer benefit

  • The shortest part times thanks to the efficient combination of highspeed plasma cutting with high machine dynamics.
  • 15 – 40 % shorter cutting times with the help of the 3.75-inch cutting head optimized for thin-sheet applications.
  • Minimal operating costs due to power-saving and abrasion-free semiconductor power supply and magnet-mounted compressors.
  • Great process stability thanks to the latest Bystronic technologies.
Laser sources (power) 4400 W
Cutting range 3048 x 1524 mm
Maximum axis acceleration 12 m/s2
Maximum positioning speed parallel to the axis 100 m/min
Maximum positioning speed simultaneous 140 m/min
Machine size 3015

Only available in selected markets.

Download
Collection Laser Automation EN
(pdf 5.46 MB)
BySprint Pro Datasheet en
(pdf 0.08 MB)
BySprint Pro Datasheet USA
(pdf 0.1 MB)
Video
BySprint Pro - Swift and economical
 
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